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SC303018B Molded Power Inductor

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Size Code 303018
L*W*H 3.1x3.1x1.8mm
Bonding Pad 2个
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|   SC303018B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.


型号电感值直流电阻饱和电流温升电流测试频率下载
NumLDCRIsatIrmsTEST FRAQDownload

( μH ) ( mΩ )( A )
( A )


TYPMAXMAXMAX

SC303018B-R22M-R-S0.22 ±20%8159.0100KHz/1V1.pngSC303018B-SERIES.PDF     
SC303018B-R47M-R-S0.47 ±20%11108.0100KHz/1V1.pngSC303018B-SERIES.PDF     
SC303018B-1R0M-R-S1 ±20%216.55.5100KHz/1V1.pngSC303018B-SERIES.PDF     
SC303018B-1R5M-R-S1.5 ±20%286.34.4100KHz/1V1.pngSC303018B-SERIES.PDF     
SC303018B-4R7M-R-S4.7 ±20%874.03.0100KHz/1V1.pngSC303018B-SERIES.PDF     


Package：3000pcs/r




|   SC303018B Molded Power Inductor Size


A：3.1±0.1 mmB：3.1±0.1 mm
C：1.8MAX mmD：1.0typ mm
E：1.0±0.2 mmf：0.9typ mm
g：3.2typ mmh：3.1typ mm


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|   SC303018B Molded Power Inductor Application

SC303018B Molded Power Inductor is widely used in consumer electronics, wireless headphones, smart watches, hard drives, mobile satellite communications, tablets, etc.

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