SC252012B Molded Power Inductor

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Size Code 252012
L*W*H 2.5x2x1.2mm
Bonding Pad 2个
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|   SC252012B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.


型号电感值直流电阻饱和电流温升电流测试频率下载
NumLDCRIsatIrmsTEST FRAQDownload

( μH ) ( mΩ )( A )
( A )


TYPTYPMAXTYPTYP

SC252012B-R22M-R-S0.2214158.461MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-R33M-R-S0.3313167.551MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-R47M-R-S0.47162264.71MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-R68M-R-S0.6824295.84.51MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-1R0M-R-S138434.53.41MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-1R5M-R-S1.548603.73.61MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-2R2M-R-S2.265873.22.31MHz/1V1.pngSC252012B-SERIES.PDF     
SC252012B-3R3M-R-S3.31181402.61.91MH.z/1V1.pngSC252012B-SERIES.PDF     
SC252012B-4R7M-R-S4.71481701.91.61MHz/1V1.pngSC252012B-SERIES.PDF      
SC252012B-100M-R-S103604201.51.21MHz/1V1.pngSC252012B-SERIES.PDF     


Package:3000pcs/r





|   SC252012B Molded Power Inductor Size


A:2.5±0.2 mmB:2.0±0.2 mm
C:1.2MAX mmD:0.7typ mm
E:0.8±0.2 mmf:0.6typ mm
g:2.7typ mmh:2.1typ mm


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|   SC252012B Molded Power Inductor Application

SC252012B Molded Power Inductor is widely used in consumer electronics, wireless headphones, smart watches, hard drives, mobile satellite communications, tablets, etc.


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