SC201608B Molded Power Inductor-Small size

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SC201608B Series Mini Molded Inductors (Produced by Fenfa Electronics) Technical Highlights:
- Wound with flat wire and hot-pressed into a single unit
- Custom-developed metal powder formulation for high performance
- Uniform spray coating, available in black and gray
Size Code 201608
L*W*H 2x1.6x0.8mm
Bonding Pad 2
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Detail

|   SC201608B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.


型号电感值直流电阻饱和电流温升电流下载
NumLDCRIsatIrmsDownload

( μH ) at 1MHz/1V( mΩ )( A )
( A )

±20%TYPMAXTYPMAXTYPMAX
SC201608B-R22M-R-S0.2214196.15.66.65.91.png
SC201608B-R24M-R-S0.24142065.5

6.5

5.81.png
SC201608B-R33M-R-S0.3318245.85.3

5.5

4.81.png
SC201608B-R47M-R-S0.4724275.55

5.5

5.21.png
SC201608B-R68M-R-S0.6839444.64.2

3.8

3.51.png
SC201608B-1R0M-R-S145523.83.5

3.6

3.31.png
SC201608B-1R5M-R-S1.5738532.8

3.1

2.81.png
SC201608B-2R2M-R-S2.21501802.42.2

2.3

2.11.png
SC201608B-3R3M-R-S3.32002202.11.8

1.8

1.51.png
SC201608B-4R7M-R-S4.72602901.71.5

1.6

1.41.png
SC201608B-6R8M-R-S6.83604051.41.3

1.4

1.21.png
SC201608B-100M-R-S1069080010.9

1

0.91.png


Package:3000pcs/r





|   SC201608B Molded Power Inductor Size


A:2±0.2 mmB:1.6±0.2 mm
C:0.8MAX mmD:0.6±0.2 mm
E:0.7±0.2 mmf:0.5typ mm
g:2.1typ mmh:1.7typ mm


1.jpg






|   SC201608B Molded Power Inductor Application


SC201608B Molded Power Inductor is Widely used in DC/DC converters, tablets, smart phones, portable gaming devices, smart wearables, Wi-Fi modules, laptops, VR, AR, LCD displays, HDDs, DVCs, DSCs, baseband power supplies, amplifiers, power management, module power supplies, camera power supplies, etc.