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SC201212B Molded Power Inductor-Small size

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SC201212B Series Mini Molded Inductors (Produced by Fenfa Electronics) Technical Highlights:
- Wound with flat wire and hot-pressed into a single unit
- Custom-developed metal powder formulation for high performance
- Uniform spray coating, available in black and gray
Size Code 201212
L*W*H 2x1.2x1.2mm
Bonding Pad 2
sales@coilsfenfa.com;marketing@coilsfenfa.com
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Detail

|   SC201212B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.



型号电感值直流电阻饱和电流温升电流下载
NumLDCRIsatIrmsDownload

( μH ) at 1MHz/1V( mΩ )( A )
( A )

±20%TYPMAXTYPMAXTYPMAX
SC201212B-R10M-R-S0.15.461211.512111.png
SC201212B-R11M-R-S0.1155.81211

12

111.png
SC201212B-R24M-R-S0.24131598.5

7.7

7.21.png
SC201212B-R33M-R-S0.331720.5

6.5

6

6.3

5.81.png
SC201212B-R47M-R-S0.4720225.55

6.2

5.71.png
SC201212B-R68M-R-S0.6826325.24.5

4.8

4.41.png
SC201212B-1R0M-R-S1404843.6

3.9

3.51.png
SC201212B-1R5M-R-S1.570803.33

3

2.71.png
SC201212B-2R2M-R-S2.21151302.82.4

2.5

2.31.png
SC201212B-3R3M-R-S3.318021021.8

1.8

1.61.png
SC201212B-6R8M-R-S6.83704401.51.3

1.4

1.31.png
SC201212B-100M-R-S104405001.41.2

1.2

1.11.png


Package：3000pcs/r




|   SC201212B Molded Power Inductor Size


A：2±0.2 mmB：1.2±0.2 mm
C：1.2MAX mmD：0.6±0.2 mm
E：0.7±0.2 mmf：0.5typ mm
g：2.1typ mmh：1.3typ mm


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|   SC201212B Molded Power Inductor Application

SC201212B Molded Power Inductor is Widely used in DC/DC converters, tablets, smart phones, portable gaming devices, smart wearables, Wi-Fi modules, laptops, VR, AR, LCD displays, HDDs, DVCs, DSCs, baseband power supplies, amplifiers, power management, module power supplies, camera power supplies, etc.


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