SC201206B Molded Power Inductor-Small size

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SC201206B Series Mini Molded Inductors (Produced by Fenfa Electronics) Technical Highlights:
Flat wire winding with hot-press molded construction
Custom-developed metal powder formulation for high performance
Uniform spray coating, available in black and gray
Size Code 201206
L*W*H 2x1.2x0.65mm
Bonding Pad 2
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Detail

|   SC201206B Molded Power Inductor Specification

On the mobile device, hold the table and swipe left or right to view the detailed parameters.


型号电感值直流电阻饱和电流温升电流下载
NumLDCRIsatIrmsDownload

( μH ) at 1MHz/1V( mΩ )( A )
( A )

±20%TYPMAXTYPMAXTYPMAX
SC201206B-R15M-R-S0.1512146.5665.51.png
SC201206B-R24M-R-S0.2417204.84.8

4.8

4.51.png
SC201206B-R33M-R-S0.3330354.34.3

4.3

41.png
SC201206B-R47M-R-S0.47374444

3.8

3.51.png
SC201206B-R68M-R-S0.6850603.23.2

3.3

31.png
SC201206B-1R0M-R-S178862.52.5

2.6

2.31.png
SC201206B-1R5M-R-S1.511513522

2.1

1.81.png
SC201206B-2R2M-R-S2.21752001.61.6

1.8

1.51.png
SC201206B-4R7M-R-S4.747053011

1.1

0.91.png
SC201206B-100M-R-S10130015000.60.6

0.6

0.51.png


Package:3000pcs/r





|   SC201206B Molded Power Inductor Size


A:2±0.2 mmB:1.2±0.2 mm
C:0.65MAX mmD:0.6±0.2 mm
E:0.7±0.2 mmf:0.5typ mm
g:2.1typ mmh:1.3typ mm


1.jpg






|   SC201206B Molded Power Inductor Application

SC201206B Molded Power Inductor is Widely used in DC/DC converters, tablet computers, smart phones, portable gaming devices, smart wearables, Wi-Fi modules, laptops, VR, AR, LCD displays, HDDs, DVCs, DSCs, baseband power supplies, amplifiers, power management, module power supplies, camera power supplies, etc.